Work

Effect of ultrasonic loading time on the microstructures and performance of Cu/Al joints at solid-liquid mixed state

Year: 2026

Type: article

Source: Microelectronics International

DOI: 10.1108/mi-04-2026-0100

Authors: GuiSheng Gan, JunFeng Dou, Jiajun Zhang, FangLiang Li, MingLi Geng, RuiZhe Xing, Ye Tian

Institutions: Chongqing University of Technology, Henan University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Chongqing

Awards: G3214658958, G4732817329, G6949653113

OpenAlex ID: W7171558467

FWCI:

Cites: 27

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