Work

Engineering Mechanically Compliant Metallic Interfaces for Soft Bioelectronics

Year: 2026

Type: article

Source: Transactions on Electrical and Electronic Materials

DOI: 10.1007/s42341-026-00719-y

Authors: Hye Jin Kim, Dae-Hyeong Kim

Institutions: Yonsei University, Institute for Basic Science, Yonsei University Mirae Campus, Seoul National University

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Research Foundation of Korea, Institute for Basic Science

Awards: G1540291181, G354572537, G977561233

OpenAlex ID: W7171790311

FWCI:

Cites: 106

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Related to: 10