Work

Research on the protrusion behavior and evolution mechanism of TSV in 3D packaging under high temperature

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-02-2026-0014

Authors: Jiahao Liu, Lijin Qiu, Bin Zhou, Hao Zhao, XiaoDong Jian, Fangzhou Chen, Dongyang Tian

Institutions: Harbin Institute of Technology, China Electronic Product Reliability and Environmental Test Institute, Xiamen University of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Key Research and Development Program of China

OpenAlex ID: W7171885572

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Cites: 26

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