Work

Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs

Year: 2026

Type: conference-paper

Source: International Conference on Modern Circuits and Systems Technologies

DOI: 10.1109/mocast70204.2026.11626350

Authors: Ilias Exouzidis, Alberto Garcia-Ortiz, George Floros, Georgios Panagopoulos

Institutions: National Technical University of Athens, University of Bremen, University of Thessaly

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7171972035

FWCI:

Cites: 8

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