Work

Homologous Bisphenol-A Modification Enables SiO2/Epoxy Composites with Ultralow Thermal Expansion, High T g, and Superior Thermal Shock Resistance for Power Device Packaging

Year: 2026

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.6c01964

Authors: Fenglei Cao, Yishu Wang, Qiang Jia, Xu Gao, Ruochen Liu, Fu Guo

Institutions: Beijing University of Technology, Beihang University, Beijing Information Science & Technology University

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G7369854719

OpenAlex ID: W7172431943

FWCI: 2.01

Cites: 83

Cited by: 1

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