Work

Temperature‐Triggered Reversible Conductive Adhesive Enabling Reconfigurable and Recyclable Soft–Rigid Hybrid Electronics

Year: 2026

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.77884

Authors: Jing Sun, Huan Yu, Huoerhute Yelemulati, Hang Zhao, Qiong Tian, Yan Liu, Fei Long, Qinyi Zhao, Sida Wang, Xinyue Hu, Jianping Huang, Zihao He, Chenyang Li, Mei Yu, Rui Su, Wen Hou, Ping Wang, Hanfei Li, Fei Han, Guanglin Li, Dianpeng Qi, Zhiyuan Liu, Qingsong Li

Institutions: Chinese Academy of Sciences, Harbin Institute of Technology, Shenzhen Institutes of Advanced Technology, Guangdong Provincial Key Laboratory of Robotics and Intelligent Systems, Ministry of Industry and Information Technology, Shandong University, Shenzhen University of Advanced Technology

Language: English

Topic: Advanced Sensor and Energy Harvesting Materials

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G44676084, G524268998, G5638134369, G6661616961, G7023217325, G7379443137, G7587000776, G8356145536, G9000338900

OpenAlex ID: W7203887254

FWCI:

Cites: 32

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