Silicon Photonics for Co‐Packaged Optics: A Review of Core PIC Components and Industry Strategies
Year: 2026
Type: article
Source: Advanced Materials Technologies
DOI: 10.1002/admt.71266
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7203907270