Year: 2026
Type: preprint
Abstract: Artifact for the ASPLOS 2027 paper "mold: A Massively Parallel Linker". This artifact contains the software and experimental materials needed to reproduce the main evaluation results in the paper. It includes the mold linker, build and evaluation scripts, a container image, and benchmark inputs for the evaluated applications. The provided workflows reproduce the main performance, scalability, and ablation-study results reported in the paper.
Source: arXiv (Cornell University)
Author: Ueyama, Rui
Institution: The University of Tokyo
Subfield: Hardware and Architecture
Field: Computer Science
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W7204089059
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