Work

Voltage Control Scheme to Mitigate Thermal Effects in Hybrid Bonding 3D NAND

Year: 2026

Type: article

Source: JSTS Journal of Semiconductor Technology and Science

DOI: 10.5573/jsts.2026.26.4.292

Authors: Dohyun Kim, Wonbo Shim

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W7204170128

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