Work

Mobile‐Chain‐Assisted Flow Alignment and Interfacial Adaptation Enable Elastomeric Thermal Interface Materials with High through‐Plane Thermal Conductivity and Low Contact Thermal Resistance

Year: 2026

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.78069

Authors: Zhaoyu Lu, Xiangyu Nie, Xin Zhang, Junyan Wang, Letian Zhou, Changshuai Chen, Zhenxu Nie, Junzhe Yang, Haoxiang Li, Junfeng Chu, Yangyang Gao, Jingchao Li, Yonglai Lu

Institutions: State Key Laboratory of Organic-Inorganic Composite Materials, Beijing University of Chemical Technology, Xi'an Jiaotong University, Beijing Forestry University

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Natural Science Foundation of Beijing Municipality, Beijing University of Chemical Technology

Awards: G231070619, G6816096425

OpenAlex ID: W7204884456

FWCI:

Cites: 44

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