Work

Stack-height-aware thermal management of HBM packages via selective NCF thermal conductivity strategy

Year: 2026

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2026.116286

Authors: Yuna Lee, Jeong Hun Song, Sang Won Yoon

Institution: Seoul National University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Research Foundation of Korea

Award: G2071672893

OpenAlex ID: W7208757966

FWCI:

Cites: 5

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