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Bridging a Gap between Physical and Electrical Failure Analysis: Fault Localization on TEM Lamellae Enabled by Workflow Redesign and optional Probing Pads

Year: 2026

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2026p0413

Authors: Rik Otte, Claud van Oers, Leon van Nimwegen, Gwen Visser, Benjamin Lo Yuen Sum, Andy Hsu, Alan Ling, Toby Chen

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7214979345

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