The impact of HfO2 dielectric layers deposited at different temperatures on performance and reliability of hydrogen-terminated single-crystal diamond MOSFETs
Year: 2026
Type: article
Abstract: Gate dielectric plays a critical role in determining the electrical performance and stability of hydrogen-terminated diamond (H-diamond) Metal Oxide Semiconductor Field Effect Transistors (MOSFETs). This work systematically investigates the influence of HfO$_2$ dielectric layers deposited at different temperatures (80 ℃, 150 ℃, 250 ℃ and 350 ℃) on device performance and reliability. HfO2films of identical thickness were deposited on hydrogen-terminated single-crystal diamond using atomic layer deposition. Electrical output and transfer characteristics were evaluated through cyclic gate bias sweeps in both positive-to-negative and negative-to-positive directions. Under both sweep directions, the saturation current density and threshold voltage exhibited a clear positive correlation with deposition temperature. The subthreshold swing showed a positive temperature dependence when the gate was swept from negative-to-positive. Notably, the device with HfO2 deposited at 150 °C demonstrated the best overall stability, offering valuable guidance for the development of stable H-diamond high-k dielectric MOSFETs.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $3,540
Award: G5934708566
OpenAlex ID: W7215100099
