Work

High-Frequency Pulse-Assisted Micro-Jet Electrochemical Deposition of Copper for High-Performance Interconnect Structures: Grain Refinement, Enhanced Mechanical Strength, and Corrosion Resistance

Year: 2026

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1945-7111/aebac2

Authors: Jiahui Tang, Yong Liu, Pengfei Dong, Kan Wang, Huanghai Kong, Chenxin Li

Institution: Shandong University

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Shandong Province

OpenAlex ID: W7224089335

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