Shear Response and Local Structural Evolution of Through‐Glass Vias (TGVs) in Borosilicate Glasses: A Molecular Dynamics Study
Year: 2026
Type: article
DOI: 10.1111/jace.71346
Institution: Donghua University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7224118092
