Work

Test Vehicle and Metrology for Defectivity Study in Wet Processes

Year: 2026

Type: article

Abstract: Controlling defectivity is critical for achieving high yield and performance in advanced CMOS fabrication. Wet processing presents key challenges such as pattern collapse, non-uniform etching, and incomplete cleaning in high-aspect-ratio (HAR) structures. To effectively optimize single-wafer wet process conditions with good across-wafer uniformity, well-designed test vehicles and advanced metrology are indispensable. This paper provides an overview of 300 mm patterned wafer test vehicles, as well as recent developments in advanced metrologies. Together, they offer a robust framework for quantitatively assessing process performance, thereby enabling more efficient and reliable single-wafer processing.

Source: Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena

DOI: 10.4028/p-y1nxms

Authors: Xiu Mei Xu, Mohamed Saib, Farid Sebaai, Christie Delvaux, Murat Pak, Efrain Altamirano-Sanchez

Institution: IMEC

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Funders: European Commission, Vlaamse regering, HORIZON EUROPE Framework Programme

Awards: European pilot line for beyond 2nm leading edge System-on-Chip leadership, G6057811149, G7389184707, G7795100286