Year: 2026
Type: article
Abstract: We report on wet processing techniques developed for two novel n-type dipole materials, ZrO x and YO x . Through etching evaluations, H₂SO₄ and CO₂ water were identified as effective and selective etchants for ZrO x and YO x , respectively. The etching rate was sufficiently low (0.1 - 0.3 nm/min), enabling precise thickness control required for dipole tuning. Electrical characterization using MOS capacitors confirmed that these wet processes successfully removed dipole materials, recovering effective work function (EWF). These results demonstrate the feasibility of wet patterning for dipole-first integration and provide a foundation for scalable, thermally efficient multi-V t device fabrication.
DOI: 10.4028/p-58eh1i
Institutions: IMEC, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W7224565452
