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Multi-Axis Vibration Testing And Strain Analysis Of Printed Circuit Boards In Truck Transport

Year: 2026

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4072776

Authors: Amin Joodaky, Reza Najafi Zare, Saeid Ansari Sadrabadi, Mayank Jain, Mojtaba Safari, Fazle Rabbi

Institution: Michigan State University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7224829016

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