Work

Complementary Hydrogen-Bonded Dual-Network Bismaleimides for Cohesive Adhesion at Metal–Polymer Interfaces

Year: 2026

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.6c03620

Authors: Jeong Hwa Yoon, Hayoung Cho, Jung Min Bae, Kisu Kim, Young Hoon Yoon, Min Wook Lee, Wonjin Na, Youngho Eom, Ki-Ho Nam

Institutions: Kyungpook National University, Hanyang University, Korea Institute of Science and Technology, Korea Dyeing & Finishing Technology Institute

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Research Foundation of Korea

OpenAlex ID: W7225013337

FWCI:

Cites: 45

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Related to: 10