Work

Process-Decoupled Integration of Functional Polymer Dielectrics via Metal–Polymer Direct Bonding

Year: 2026

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.6c01683

Authors: Dong Yun Sung, Ji Yun Lee, Seo Yeon Choi, Hyung Jun Kim, Min Ju Kim, Jong Kyung Park, Sarah Eunkyung Kim, Seul Ki Hong

Institutions: Seoul National University of Science and Technology, Dankook University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Research Foundation of Korea

OpenAlex ID: W7225125510

FWCI:

Cites: 42

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Related to: 10