Work

AeroSolder-NiCu™: Low-Pressure Transient Liquid Phase Sintering of Graphene-Passivated Ni-Cu Nano-Alloy Displacing Nano-Silver in SiC/GaN Die-Attach

Year: 2026

Type: preprint

Abstract: Preprint presenting AeroSolder-NiCu™, a submicron core-shell Cu@Ni@G nano-alloy in a TLPS vehicle for wide bandgap (SiC/GaN) power module die-attach. Densifies at 195°C under <1 MPa, operates stably >420°C, delivers 230 W/mK thermal conductivity, suppresses electrochemical migration beyond 1,850h, cuts material expense by 95.6% ($110/kg vs $2,500/kg), and saves $71.70 per 800V EV traction inverter.

Source: Zenodo (CERN European Organization for Nuclear Research)

DOI: 10.5281/zenodo.24019004

Author: Antigravity Advanced Materials Laboratory

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W7225397582

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