Flexible Phase Change Adhesive Allowing Tunable Melting Point for Flexible Electronics Thermal Management with Controlled Adhesion
Year: 2026
Type: article
Authors: Jianfeng Liu, Jianhui Xia
Institution: South China University of Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7225433260
