Work

Reliability analysis of PBGA lead-free interconnect solder joints under drop impact load

Year: 2026

Type: article

Source: Microelectronics International

DOI: 10.1108/mi-02-2026-0033

Authors: Xuexia Yang, Yanxi Sun, Miao Zhu, Yijie Du, Shuai Shi, Jinbao Lin, Gesheng Xiao

Institutions: Taiyuan University of Science and Technology, Taiyuan University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7225663357

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Cites: 19

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