Work

Porous-Architectured Composite for Fully 3D-Printed Biodegradable Soft Electronics

Year: 2026

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.6c18846

Authors: Joo-Hyeon Park, Ju-Yong Lee, Se-Hun Kang, Minseong Chae, Minjung Chae, Jeongwoo Ham, Jae-Young Bae, Yong-Wu Kim, Jong-hyoung Kim, Myoung-Ryul Ok, Seung-Kyun Kang

Institutions: Seoul National University, Stanford University, Asan Medical Center, Korea Institute of Science and Technology, Pukyong National University, Korea University of Science and Technology

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7225787045

FWCI:

Cites: 78

Cited by:

Related to: