Process–Performance Mapping of Aerosol Jet Printed Silver Traces: From Thermal Curing Parameters to RF Characteristics of Microstrip Devices
Year: 2026
Type: article
Source: Engineering Research Express
Institution: Shenyang Ligong University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7225808090
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