Work

Low-Cost Alternatives in Hybrid Microcircuit Packaging

Year: 1983

Type: article

Source: NASA Tech Briefs

Authors: S. V. Caruso, Victoria L. Champion, R. N. Bassett, J. N. Gayer

Institution: Rockwell International (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W832499073

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Related to: 20