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Oliver Kallensee

Observed name: O. Kallensee
OpenAlex ID: A5000805886
Manufacturable 22nm FD-SOI Embedded MRAM Technology for Industrial-grade MCU and IOT Applications
2019 · V. B. Naik, K. Lee, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 78
JEDEC-Qualified Highly Reliable 22nm FD-SOI Embedded MRAM For Low-Power Industrial-Grade, and Extended Performance Towards Automotive-Grade-1 Applications
2020 · V. B. Naik, K. Yamane, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 49
Extended MTJ TDDB Model, and Improved STT-MRAM Reliability With Reduced Circuit and Process Variabilities
2022 · V. B. Naik, J. H. Lim, et al. · IEEE International Reliability Physics Symposium proceedings · 15
STT-MRAM: A Robust Embedded Non-Volatile Memory with Superior Reliability and Immunity to External Magnetic Field and RF Sources
2021 · V. B. Naik, K. Yamane, et al. · Symposium on VLSI Technology · 11
STT-MRAM Product Reliability and Cross-Talk
2022 · V. B. Naik, K. Yamane, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · 5
Embedded STT-MRAM for Automotive Applications
2024 · J. Müller, B. Pfefferling, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · 4
From Emergence to Prevalence: 22FDX® Embedded STT-MRAM
2022 · Johannes Müller, Aleksandra Titova, et al. · IEEE International Memory Workshop (IMW) · 2
Magnetic Immunity in STT-MRAM a Rational Approach to a Manageable Challenge
2026 · Johannes Mueller, Frank Schlaphof, et al. · IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)
Advanced gate stack work function optimization and substrate dependent strain interactions on HKMG first stacks for 28nm VLSI ultra low power technologies
2013 · J. Hoentschel, Shiang Yang Ong, et al. · Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon
Works count: 9
Citation count: 164
H-index: 5
I10-index: 4
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