Author

Gilles Segond

Observed names: G. Segond, Gilles SEGOND, Segond, Gilles

OpenAlex ID: A5000887603

Influence of PWM Methods on Semiconductor Losses and Thermal Cycling of 15-kVA Three-Phase SiC Inverter for Aircraft Applications

2020 · Bernardo Cougo, Lenin Morais, et al. · Electronics · 32

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Modeling and Analysis of EMI and Overvoltage Phenomenon in SiC Inverter Driven Motor at High Switching Frequency

2018 · Duc-Hoan Tran, Gilles Segond, et al. · International Power Electronics and Motion Control Conference (EPE-PEMC) · 10

Influence of PWM methods in semiconductor losses of 15kVA three-phase SiC inverter for aircraft applications

2017 · Bernardo Cougo, Duc-Hoan Tran, et al. · European Conference on Power Electronics and Applications · 10

Optimal design of a three-phase 540V/70kVA SiC inverter for aircraft applications

2023 · Duc Hoan Tran, Bernardo Cougo, et al. · IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC) · 8

Precise estimation of dynamic junction temperature of SiC transistors for lifetime prediction of power modules used in three-phase inverters

2023 · Alice Teixeira, Bernardo Cougo, et al. · Microelectronics Reliability · 6

Design of three-level flying-capacitor commutation cells with four paralleled 650 V/60 A GaN HEMTs

2021 · Hans H. Sathler, Tianyu Zhao, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 6

Loss reduction of WBG inverter by PWM techniques for the motion control of PMSM

2019 · Hoan TRAN DUC, Bernardo COUGO, et al. · IEEE International Future Energy Electronics Conference (IFEEC) · 3

High Frequency Power Cycling of Three-Phase Inverters for Aircraft Applications

2026 · Alice H. T. Silva, Bernardo Cougo, et al. · Eletrônica de Potência

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Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite

2026 · M. Leicht, B. Arati, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Modeling and measurement of high frequency temperature variation of GaN transistors for inverter and rectifier applications

2026 · Duc Hoan Tran, Bernardo Cougo, et al. · Microelectronics Reliability

Modélisation et mesure de la variation de température à haute fréquence d'un transistor GaN pour les onduleurs de puissance

2025 · Tran Duc, Hoan, Cougo, Bernardo, et al. · HAL

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Works count: 12

Citation count: 75

H-index: 6

I10-index: 3