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Thomas Voss
Observed names:
T. Voss,
Thomas Voß,
Voss, Thomas,
Voß, Thomas
Institution:
Leibniz Institute for High Performance Microelectronics
Observed institution:
Leibniz Institute for High Performance Microelectronics
OpenAlex ID:
A5003661703
Gain enhancement of BiCMOS on-chip sub-THz antennas by mean of meta-cells
2022
·
Matteo Stocchi
, Zhibo Cao
, et al.
·
Scientific Reports
·
15
PDF
BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications
2017
·
Mesut Inac
, Matthias Wietstruck
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer
2018
·
M. Wietstruck
, S. Marschmeyer
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Accurate Depth Control of Through-Silicon Vias by Substrate Integrated Etch Stop Layers
2017
·
M. Wietstruck
, S. Marschmeyer
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Terahertz subwavelength sensing with bio-functionalized germanium fano-resonators
2022
·
Carlos Alvarado Chavarin
, Elena Hardt
, et al.
·
Frequenz
·
3
Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology
2017
·
M. Wietstruck
, S. Marschmeyer
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling
2021
·
Patrick Kruger
, Thomas Voss
, et al.
·
IEEE International D Systems Integration Conference
·
2
Preparation of Germanium-on-insulator (GOI) wafers by means of layer transfer tehnique
2020
·
Marco Lisker
, Andreas Kruger
, et al.
·
Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
·
2
Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding
2017
·
M. Inac
, M. Wietstruck
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Layer Transfer Process Development For SiGe Based Microbolometer Integration
2020
·
Canan Baristiran Kaynak
, Alexander Goeritz
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Antenna Characterization Methodology for Backside-Radiating D-Band Integrated Dielectric Resonator Antenna Array Using Teflon Fixture
2026
·
Kanaka Joy
, Muhammad F. Bashir
, et al.
·
European Microwave Conference (EuMC)
240 GHz Dielectric Resonator Antenna Array with Etch Profile Analysis in a BiCMOS BEOL Silicon Interposer Technology
2026
·
Muhammad Faisal Bashir
, Thomas Voß
, et al.
·
European Conference on Antennas and Propagation
230 - 330 GHz Microstrip Leaky-Wave Antenna Array using BiCMOS BEOL Silicon Interposer
2026
·
Akanksha Bhutani
, Jiexi Yin
, et al.
·
German Microwave Conference
Silicon Interposer with Advanced RF Technology Modules for BiCMOS Wafer-Level Packaging
2026
·
Matthias Wietstruck
, Patrick Krüger
, et al.
·
German Microwave Conference
The Chip-Level in-Plane Stress Distribution over BiCMOS Wafers
2024
·
Zhibo Cao
, Thomas Voss
, et al.
·
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
The Effect of Surface Optimization on Post-grinding Yield of 200 mm Wafer Level Packaging Applications
2018
·
Mesut Inac
, Matthias Wietstruck
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications
2017
·
Inac, Mesut
, Wietstruck, Matthias
, et al.
·
HAL
BiCMOS embedded microfluidic technology based on wafer bonding techniques for biosensor applications (BiCMOS eingebettete mikrofluidiktechnologie basierend auf wafer-bonding-techniken für biosensor-anwendungen)
2017
·
Inac, Mesut
, Wietstruck, Matthias
, et al.
·
Sabanci University
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Works count:
18
Citation count:
46
H-index:
4
I10-index:
1
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