Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Matthias Kraatz
Observed names:
Kraatz, Matthias,
M. Kraatz
Institution:
Fraunhofer Institute for Ceramic Technologies and Systems
Observed institutions:
Fraunhofer Institute for Nondestructive Testing,
GlobalFoundries (Germany),
Fraunhofer Institute for Ceramic Technologies and Systems,
Brandenburg University of Technology Cottbus-Senftenberg,
Carnegie Mellon University,
The University of Texas at Austin
show all 6
ORCID:
0000-0002-9534-7060
Observed ORCID:
0000-0002-9534-7060
OpenAlex ID:
A5005259128
Organic Phase Resistance to Dissolution of Polycyclic Aromatic Hydrocarbon Compounds
1998
·
Enrique Ortiz
, Matthias Kraatz
, et al.
·
Environmental Science & Technology
·
70
Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation
2009
·
Ehrenfried Zschech
, Paul S. Ho
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
23
In-situ X-ray tomographic imaging and controlled steering of microcracks in 3D nanopatterned structures
2022
·
Kristina Kutukova
, Jürgen Gluch
, et al.
·
Materials & Design
·
18
PDF
Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation
2010
·
Lijuan Zhang
, Matthias Kraatz
, et al.
·
AIP conference proceedings
·
18
Effect of Al Concentration on Ferroelectric Properties in HfAlO x ‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications
2023
·
Jihyung Kim
, Dahye Kim
, et al.
·
Advanced Intelligent Systems
·
11
PDF
Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
2010
·
L. Zhang
, M. Kraatz
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
9
A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
2016
·
Matthias Kraatz
, Martin Gall
, et al.
·
Computational Materials Science
·
8
Effect of Al Concentration on Ferroelectric Properties in HfAlO x ‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications
2023
·
Jihyung Kim
, Dahye Kim
, et al.
·
Advanced Intelligent Systems
·
5
PDF
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects
2021
·
Z. Zhang
, M. Kraatz
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
5
Scaling effects on microstructure and reliability for Cu interconnects
2010
·
Paul S. Ho
, Ehrenfried Zschech
, et al.
·
International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)
·
5
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses
2024
·
J. Shuster-Passage
, S. Abdel Razek
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
4
Reduction of the initial defect density and improvement of the reliability of Cu/low-k structures by a methylating treatment
2005
·
Swarnal Borthakur
, Sri Satyanarayana
, et al.
·
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena
·
3
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
2018
·
M. Kraatz
, C. Sander
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
1
Studying the effect of Cu microstructure on electromigration reliability using statistical simulation
2011
·
Matthias Kraatz
·
Texas ScholarWorks (Texas Digital Library)
·
1
Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects
2009
·
Hyun Park
, Matthias Kraatz
, et al.
·
Springer eBooks
·
1
Effects of Grain Structure on Electromigration of Cu Interconnects
2008
·
Paul S. Ho
, Ehrenfried Zschech
, et al.
·
ECS Meeting Abstracts
·
1
PDF
Simulation of Electrical and Mechanical Properties of Air-Bridge Cu Interconnects
2006
·
Hyun Park
, Matthias Kraatz
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
1
Integration of a Polymer Etch Stop Layer in a Porous Low K MLM Structure
2005
·
Gregory C. Smith
, Neil Henis
, et al.
·
MRS Proceedings
·
1
Quantification of Local Elastic Properties Using Ultrasonic Force Microscopy
2003
·
Matthias Kraatz
·
AIP conference proceedings
·
1
PDF
Advanced Analysis and Monitoring of Failure Mechanisms in Microelectronics Metallization
2024
·
André Clausner
, Matthias Kraatz
, et al.
·
Pan Pacific Symposium
Advanced Analysis and Monitoring of Failure Mechanism Thin as well as Thick Microelectronics Metallization Structures
2024
·
André Clausner
, Matthias Kraatz
, et al.
·
Pan Pacific Symposium
Automatische Korngrößenanalyse im Sub-Mikrometer-Bereich mittels AFM-Bildauswertung / Automated Grain Size Analysis in the Sub-Micron Range with AFM Image Processing
2003
·
M. Kraatz
, C. Heliot
, et al.
·
Practical Metallography
Measurement of Local Gradients of Thin Film Stiffness using Ultrasonic Force Microscopy
2002
·
H. Geisler
, Matthias Kraatz
, et al.
·
APS
Show more works
View as search
Works count:
25
Citation count:
186
H-index:
7
I10-index:
5
Year
Topic
Type
