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Le‐Xin Chen

Observed names: L. D. Chen, L.D. Chen, Le-Xin Chen
ORCID: 0009-0003-3176-6631
Observed ORCID: 0009-0003-3176-6631
OpenAlex ID: A5006876963
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect
2006 · Robin C.J. Wang, C.C. Lee, et al. · Microelectronics Reliability · 24
Effect of thickness and aging on key mechanical properties of 3D‐printed crowns
2025 · Pei‐Wen Peng, Chiao‐Yun Peng, et al. · European Journal Of Oral Sciences · 4
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Influence of Post-Washing Time and Build Orientation on Mechanical Properties and Biocompatibility of Additively Manufactured Permanent Dental Resin Material
2025 · Pei-Wen Peng, Jia-Syuan Chou, et al. · Polymers · 4
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Interfacial stress characterization for stress-induced voiding in Cu/low-k interconnects
2005 · R.C.J. Wang, L.D. Chen, et al. · International Symposium on the Physical and Failure Analysis of Integrated Circuits · 3
Accuracy and fitness of digital light processing-fabricated resin-based permanent crowns after thermal aging
2025 · Pei-Wen Peng, Wei-Jen Chang, et al. · Journal of Dental Sciences · 2
Copper stress migration at narrow metal finger with wide lead
2007 · Robin C.J. Wang, K.S. Chang-Liao, et al. · Microelectronic Engineering · 2
Study of a new electromigration failure mechanism by novel test structure
2015 · L. D. Chen, B. L. Lin, et al. · IEEE International Reliability Physics Symposium proceedings · 1
Works count: 7
Citation count: 40
H-index: 3
I10-index: 1
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