Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Eric Campbell
Institution:
IBM (United States)
Observed institution:
IBM (United States)
OpenAlex ID:
A5014050776
A Case Study of Nickel Dendritic Growth on Printed-Circuit Boards
2020
·
Prabjit Singh
, Madhana Sunder
, et al.
·
Pan Pacific Symposium
·
5
Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints
2024
·
Prabjit Singh
, L. Palmer
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
3
IBM POWER9 Systems, Shock Simulation and Testing Validation
2019
·
Arshad Alfoqaha
, Kevin O’Connell
, et al.
·
ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE)
·
1
Creep Corrosion Testing of Conformally Coated PCBs
2025
·
Theron Lewis
, Eric Campbell
, et al.
·
Cleaning and Coating Conference
A Case Study of Nickel Dendritic Growth on Printed-Circuit Boards
2020
·
Prabjit Singh
, Madhana Sunder
, et al.
·
Pan Pacific Symposium
Show more works
View as search
Works count:
5
Citation count:
9
H-index:
2
I10-index:
Year
Topic
Type
