2017 · Gamal Refai-Ahmed, Hoa Do, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
2009 · Arun Prakash Raghupathy, Attila Aranyosi, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 3