Author

Simon J. Kirk

Observed names: Simon J Kirk, Simon Kirk

Institution: DuPont (United States)

Observed institution: DuPont (United States)

OpenAlex ID: A5017208819

Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling

2010 · Mel Zussman, Chris Milasincic, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 16

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Effect of de-ionized water parameters rinse on postmetal etch residue removal using semiaqueous cleaning chemistries

2002 · Robert Small, Simon Kirk, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 7

Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries

2010 · Sumant Sood, Shari Farrens, et al. · ECS Transactions · 6

The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries

2001 · Simon J. Kirk, Robert Small · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4

Metal Surface Preparation with Point of Use Wet Chemistry

2010 · Shari Farrens, Sumant Sood, et al. · ECS Meeting Abstracts

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Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners

2010 · Anthony B. Rardin, Simon J. Kirk, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Characterization and Optimization of Single Wafer Processing Equipment with Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes

2008 · Simon Kirk, Chiu Tse, et al. · ASMC proceedings

Metal Hardmask Etch Residue Removal For Advanced Copper / Low-k Devices

2007 · Hua Cui, Simon J Kirk, et al. · ASMC proceedings

Works count: 8

Citation count: 33

H-index: 4

I10-index: 1