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Manita Duangsang
Observed institution:
NXP (Netherlands)
OpenAlex ID:
A5020042420
Improved etching recipe for exposing Cu wire allowing reliable stitch pull
2016
·
R. Stegink
, Evan Liu
, et al.
·
Microelectronics Reliability
·
3
Overcoming Challenges in Foreign Material (FM) Analysis within BGA Packages using FTIR Spectroscopy with Solder Ball Shear
2024
·
Tatiya Ngoenklan
, Dumrong Sakulhirirak
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Case Study on Wire Bonding - Related Partial Discharge on High-Voltage Isolators
2018
·
Manita Duangsang
, Nophakam Thankham
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Currents Photoinduced on Laterally Spreading of Space-Charge-Region in Planar Metal-Semiconductor-Metal Structures
2015
·
Sanya Khunkhao
, Surasak Niemcharoen
, et al.
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Works count:
4
Citation count:
3
H-index:
1
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