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Hwanwoo Shim
Observed names:
H. Shim,
H.-W. Shim,
H.W. Shim,
Hwan-Woo Shim,
Hwan-woo Shim
Institutions:
Samsung (South Korea),
Samsung Electronics (South Korea)
Observed institutions:
Missouri University of Science and Technology,
Samsung (South Korea),
Samsung Electronics (South Korea)
ORCID:
0000-0001-9516-8014
Observed ORCID:
0000-0001-9516-8014
OpenAlex ID:
A5027770278
Model for Estimating Radiated Emissions From a Printed Circuit Board With Attached Cables Due to Voltage-Driven Sources
2005
·
H.-W. Shim
, T.H. Hubing
·
IEEE Transactions on Electromagnetic Compatibility
·
96
Derivation of a Closed-Form Approximate Expression for the Self-Capacitance of a Printed Circuit Board Trace
2005
·
H.W. Shim
, T.H. Hubing
·
IEEE Transactions on Electromagnetic Compatibility
·
23
Expert system algorithms for identifying radiated emission problems in printed circuit boards
2004
·
H. Shim
, T. Hubing
, et al.
·
15
Field Coupling Mechanism Investigation of mm-Wave Magnetic Near-Field Probe Based on a Generalized Equivalent Circuit
2022
·
Shun Liu
, Xin Fang
, et al.
·
IEEE Transactions on Instrumentation and Measurement
·
12
Electrical approach to acoustic noise for MLCCs of power delivery network in mobile system
2015
·
Hyunho Baek
, Dongho Yu
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
9
Decoupling strategies for printed circuit boards without power planes
2003
·
H.W. Shim
, T.M. Zeeff
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
8
Analysis and Solution for RF Interference Caused by PMIC Noise in Mobile Platforms
2019
·
Kiyeong Kim
, Hwan-woo Shim
, et al.
·
IEEE Transactions on Electromagnetic Compatibility
·
7
SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms
2018
·
Kiyeong Kim
, Hwan-Woo Shim
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
6
SMPS noise managing methodology for RFI solution in mobile platforms
2016
·
Kiyeong Kim
, Hyunho Baek
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
6
Statistical estimation of characteristic impedance distribution caused by PCB manufacturing process variation in high-speed mobile channels
2015
·
Kiyeong Kim
, Junho Lee
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
4
Notice of Retraction: Differential Lines Paired with Serpentine as Potential EMI Aggressors in Mobile Electronic Devices
2017
·
Antonio Ciccomancini Scogna
, Nitin Srivastava
, et al.
·
IEEE Transactions on Electromagnetic Compatibility
·
3
Enabling the next generation USB 3.1 (Gen 2) in mobile devices
2018
·
Nitin Srivastava
, Antonio Ciccomancini Scogna
, et al.
·
2
SI/PI co-optimization for LPDDR3 mobile interface
2017
·
Nitin Srivastava
, Antonio Ciccomancini Scogna
, et al.
·
Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
·
2
SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode
2017
·
Kiyeong Kim
, Hwan-Woo Shim
, et al.
·
Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
·
2
Development of a Non-Contact Ground Noise Injector on Flexible PCB for RF Immunity Test of a Mobile Phone
2025
·
Hyunjae Lee
, Junhee Han
, et al.
·
IEEE Transactions on Electromagnetic Compatibility
Notice of Retraction: Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules
2018
·
Lian Kheng Teoh
, Nitin Srivastava
, et al.
·
IEEE Transactions on Electromagnetic Compatibility
A study on electrical etching methods on the surface of an Ag nanowire for detecting ammonia vapor
2010
·
Junam Kwon
, Hwanwoo Shim
, et al.
GTD를 이용한 ogival ground상의 안테나 복사패턴과 field강도 계산 = Calculation of field intensity and radiation pattern of the antenna on the ogival ground plane by GTD
1994
·
심환우
, Hwanwoo Shim
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Works count:
18
Citation count:
195
H-index:
7
I10-index:
4
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