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Author

Behnam Madadnia

Observed names: Madadnia Behnam, Madadnia, Behnam
Institution: KU Leuven
Observed institutions: Ghent University, IMEC, KU Leuven
ORCID: 0000-0002-9189-1173
Observed ORCID: 0000-0002-9189-1173
OpenAlex ID: A5032425308
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
2022 · Behnam Madadnia, Frederick Bossuyt, et al. · The International Journal of Advanced Manufacturing Technology · 7
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Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation
2023 · Martin Hubmann, Mona Bakr, et al. · Micromachines · 5
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Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion
2022 · Martin Hubmann, Behnam Madadnia, et al. · Polymers · 5
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Significant Improvement in SNR of PMUTs by Using Transimpedance Amplifier: A Promising Architecture Towards Canonical Ultrasound Medical Imaging
2024 · Sina Sadeghpour, Behnam Madadnia, et al. · 2
Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics
2023 · Behnam Madadnia, Jan Vanfleteren, et al. · Micromachines · 2
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A Novel Method for Component Positioning in Thermoformed Electronics
2022 · Behnam Madadnia, Frederick Bossuyt, et al. · Lecture notes in networks and systems · 2
Innovative component positioning method for thermoformed electronics
2022 · Behnam Madadnia, Frederick Bossuyt, et al. · Flexible and Printed Electronics · 1
Using Grubler's Criterion theory to position the electronic components in thermoformed electronics
2022 · Behnam Madadnia, Frederick Bossuyt, et al. · Electronics System-Integration Technology Conference (ESTC) · 1
Using non-stretchable structures for component positioning in thermoformed electronics
2022 · Behnam Madadnia, Frederick Bossuyt, et al. · Flexible and Printed Electronics · 1
Ultrasound Imaging Using Stitched PMUTs in Third Vibration Mode for Enhanced Resolution
2025 · Sina Sadeghpour, Rui Amendoeira Esteves, et al. · IEEE International Ultrasonics Symposium
Reducing out-of-plane deformation of metal interconnects in structural electronics
2021 · Madadnia Behnam, Bossuyt Frederick, et al. · European Microelectronics and Packaging Conference & Exhibition (EMPC)
Works count: 12
Citation count: 26
H-index: 3
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