Get started
Author

Tatsuhiko Asai

Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions
2005 · Ikuo Shohji, Satoshi Tsunoda, et al. · MATERIALS TRANSACTIONS · 29
PDF
Development on the Application of the SnAgCu Based Lead-Free Solder a Small Amount of the Added 5 Elements Solder of Industrial Electronic Equipment
2016 · Hirohiko Watanabe, Tatsuhiko Asai, et al. · Journal of The Japan Institute of Electronics Packaging · 5
PDF
A study on the reliability of the chip surface solder joint
2008 · Yoshinari Ikeda, Yuji Iizuka, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 5
J -integral Evaluation for an Interface Crack Using Digital Image Correlation
2014 · Hiroto Yamane, Shuichi Arikawa, et al. · Jikken rikigaku · 4
Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle Test
2018 · Shunsuke KAWASHITA, Yuto NANAZOSHI, et al. · Journal of Smart Processing · 3
PDF
Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge
2007 · Ikuo Shohji, Satoshi Tsunoda, et al. · Key engineering materials · 3
J-integral evaluation for an interface crack under thermal load using digital image correlation
2015 · Hiroto Yamane, Shuichi Arikawa, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Identification of Elasto-plastic Material Properties with Full-field Surface Displacement Measurements
2014 · Keita Jinno, Shuichi Arikawa, et al. · Jikken rikigaku · 2
Application of Viscoplastic-Creep Separate Constitutive Model to Lead-Free Solder Alloy
2011 · Takeharu HAYASHI, Yoshinori EBIHARA, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 1
PDF
Creep Behavior and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-free Solder Alloy
2006 · Noboru Hidaka, Hirohiko Watanabe, et al. · 1
The Effect of the Power Module Structure (Cupper Clip Thickness) on Reliability Under Power Cycling Test
2023 · Ryoichi Kato, Yoshinari Ikeda, et al. · IEEE CPMT Symposium Japan (ICSJ)
Evaluation of the delamination strength between copper-substrate/ aluminum-cooler and encapsulation resin in a power module
2017 · Yuto NANAZOSHI, Syunsuke KAWASHITA, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
Evaluation of the delamination between resin and metallic components in a power module using nonlinear thermal stress analyses
2017 · Shunsuke Kawashita, Yuto Nanazoshi, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
Analysis of delamination of molding resin under thermal stress in a power module
2016 · Shunsuke Kawashita, Toru Ikeda, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
Evaluation of the delimitation strength of an interface between copper substrate and molding resin in a power module
2016 · Yuto NANAZOSHI, Toru IKEDA, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
The Influences Which Constitutive Models for Lead-Free Solder Alloys in General FEA Programs Give to Accumulated Inelastic Strain Behavior
2016 · Takeharu HAYASHI, Hirohiko WATANABE, et al. · Journal of Smart Processing
PDF
Attempt to Stability Improvement on FEA of Tensile Tests, Tension-Compression Tests and Stress Relaxation Tests
2015 · Takeharu HAYASHI, Yoshinori EBIHARA, et al. · Journal of Smart Processing
PDF
Fatigue Life Estimation of Lead-Free Solder Joints Using Viscoplastic-Creep Separate Constitutive Model
2014 · Takeharu HAYASHI, Hirohiko WATANABE, et al. · Journal of Smart Processing
PDF
G0310505 J-integral Evaluation from Measured Displacement Fields Using Digital Image Correlation
2014 · Hiroto YAMANE, Satoru YONEYAMA, et al. · The Proceedings of Mechanical Engineering Congress Japan
PDF
20305 Implicit Time-Integration for Viscoplastic-Creep Separate Constitutive Model
2013 · Takeharu HAYASHI, Yoshinori EBIHARA, et al. · The Proceedings of Conference of Kanto Branch
PDF
Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge
2007 · Ikuo Shohji, Satoshi Tsunoda, et al. · Key engineering materials
New lead free solder composition and physical properties of printed wiring board laminate material to suppress lift-off and improve reliability
2006 · Ken’ichi Ikeda, Hideki Ishihara, et al.
Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合強度及び接合部組織に及ぼすAg及びNi添加量の影響
2006 · 角田智史, 荘司郁夫, et al. · 日本金属学会講演概要
Works count: 23
Citation count: 55
H-index: 4
I10-index: 1
Year
Topic
Type