Author

Mooho Lee

Institutions: Samsung (South Korea), Samsung Advanced Institute of Technology (South Korea), Samsung Electronics (South Korea)

Observed institutions: Seoul National University, Samsung (South Korea), Samsung Advanced Institute of Technology (South Korea), Samsung Electronics (South Korea)

OpenAlex ID: A5048622945

Aligned structures of mesogenic motifs in epoxy resin and their thermal conductivities

2022 · Minhwan Lee, Min Young Ha, et al. · Nanoscale Advances · 7

Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al 2 O 3 /Epoxy Composites

2026 · Yeonwook Jeong, Sabina Ghorsaine, et al. · Small

Naphthalene‐Modified Cationic Initiators for Superior Polymerization Stability and Thermal Conductivity in Epoxy Thermosets

2026 · Yewon Woo, Yeonha Ju, et al. · Small Science

Works count: 3

Citation count: 7

H-index: 1

I10-index: