Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Yu-Cheng Pai
Institution:
Siliconware Precision Industries (Taiwan)
Observed institution:
Siliconware Precision Industries (Taiwan)
OpenAlex ID:
A5059831750
Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate
2023
·
Yuan-Chang Ni
, Wen-Yu Teng
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
Study of Substrate Materials on Bias-HAST Reliability of Fine Pitch FCBGA Package
2021
·
Yu-Cheng Pai
, Wen-Yu Teng
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump Pitches
2025
·
Chia-Wei Chang
, Wen-Yu Teng
, et al.
·
IMAPSource Proceedings
PDF
Influence of Flow Rate and Current Density on Copper Deposition in Through Hole
2024
·
Barry Zeng
, Rick Ye
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Investigation of Blind MicroVias Bonding Force: A Field Study
2024
·
Hung-Kun Chen
, Shun-Jen Chan
, et al.
·
International Conference on Electronics Packaging (ICEP)
Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier
2022
·
Yu-Cheng Pai
, Chan-Yu Yeh
, et al.
·
International Conference on Electronics Packaging (ICEP)
Show more works
View as search
Works count:
6
Citation count:
2
H-index:
1
I10-index:
Year
Topic
Type
