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Seahee Hwangbo
Observed name:
Sea-Hee HwangBo
Institution:
Intel (United States)
Observed institutions:
Intel (United States),
University of Florida
ORCID:
0000-0002-9897-8925
Observed ORCID:
0000-0002-9897-8925
OpenAlex ID:
A5072034895
Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna
2017
·
Seahee Hwangbo
, Hae Yong Yang
, et al.
·
IEEE Antennas and Wireless Propagation Letters
·
112
Cu/Co Multilayer-Based High Signal Integrity and Low RF Loss Conductors for 5G/Millimeter Wave Applications
2018
·
Seahee Hwangbo
, Arian Rahimi
, et al.
·
IEEE Transactions on Microwave Theory and Techniques
·
35
Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D System-in-Packaging (SiP) Using Compact Through Glass Via (TGV)-Integrated Antennas
2018
·
Seahee Hwangbo
, Yong-Kyu Yoon
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
22
An F-Band Power Amplifier with Skip-Layer Via Achieving 23.8% PAE in FinFET Technology
2022
·
Qiang Yu
, Jeffrey Garrett
, et al.
·
Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium
·
20
5G mmWave Power Amplifier and Low-Noise Amplifier in 300mm GaN-on-Si Technology
2022
·
Qiang Yu
, Han Wui Then
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
20
Airbrushing and surface modification for fabricating flexible electronics on polydimethylsiloxane
2018
·
Kartik Sondhi
, Seahee Hwangbo
, et al.
·
Journal of Micromechanics and Microengineering
·
20
PDF
Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging
2017
·
Seahee Hwangbo
, Sheng-Po Fang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
17
Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas
2016
·
Seahee Hwangbo
, Aric B. Shorey
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
16
Through Glass Via (TGV) disc loaded monopole antennas for millimeter-wave wireless interposer communication
2015
·
Seahee Hwangbo
, Arian Rahimi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
14
High-Radiation Efficiency in Array Antennas Using Cu/Co Metaconductors
2021
·
Renuka Bowrothu
, Hae-In Kim
, et al.
·
IEEE Transactions on Antennas and Propagation
·
13
Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications
2016
·
Seahee Hwangbo
, Yong-Kyu Yoon
, et al.
·
Digest - IEEE Antennas and Propagation Society. International Symposium
·
12
Investigation of Ferromagnetic Resonance Shift in Screen-Printed Barium Ferrite/Samarium Cobalt Composites
2019
·
Camilo Velez
, Seahee Hwangbo
, et al.
·
IEEE Transactions on Microwave Theory and Techniques
·
9
28GHz Through Glass Via (TGV) Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology
2019
·
Renuka Bowrothu
, Seahee Hwangbo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP
2019
·
Seahee Hwangbo
, Renuka Bowrothu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Airbrushed Dipole RF Strain Sensor Antenna on a Stretchable Polyurethane Substrate
2018
·
Kartik Sondhi
, Jacob Amontree
, et al.
·
Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ...
·
8
Reliability of Passive Printed Dipole Antennas Under Extreme Environments
2018
·
Jacob Amontree
, Kartik Sondhi
, et al.
·
IEEE International Conference on Wireless for Space and Extreme Environments (WiSEE)
·
7
Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications
2017
·
Seahee Hwangbo
, Arian Rahimi
, et al.
·
IEEE MTT-S International Microwave Symposium digest
·
7
A Study on Electric Power Monitoring System per Appliance
2010
·
Sung-Wook Park
, Jong-Shick Kim
, et al.
·
Journal of Korean institute of intelligent systems
·
5
PDF
Highly Compact, Multiband Composite-Right/Left-Handed(CRLH) Transmission Line Based Stub for GPS Applications
2019
·
Hae-In Kim
, Seahee Hwangbo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz
2018
·
Stasiu Chyczewski
, Seahee Hwangbo
, et al.
·
Wireless Power Transfer
·
3
Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications
2018
·
Timothy Clingenpeel
, Seahee Hwangbo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Low-Temperature Micropatterning of Thick-Film BaFe12O19 Composites on Semiconductor Substrates for Integrated Millimeter Wave Devices
2018
·
Camilo Velez
, Jacob Ewing
, et al.
·
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
·
2
Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition
2017
·
Sheng-Po Fang
, Seahee Hwangbo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Glass interposer integrated millimeter wave antennas for inter-/intra chip communications
2015
·
Yong-Kyu Yoon
, Seahee Hwangbo
, et al.
·
International Workshop on Antenna Technology
·
1
Low-Loss 25 GHz RF Switches in 300 mm GaN-on-Si Technology with 0.4 dB Insertion Loss and $70 \text{fs} \mathrm{R}_{\text{on }} \times \mathrm{C}_{\text{off }}$
2026
·
Seahee Hwangbo
, Qiang Yu
, et al.
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Works count:
27
Citation count:
367
H-index:
11
I10-index:
11
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