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Nduka Nnamdi Ekere

Observed names: Ekere, Nduka, Ekere, Nduka N., N N Ekere, N. Ekere, N. N. EKERE, N. N. Ekere, N.N. EKERE, N.N. Ekere, NDUKA N. EKERE, NDY N. EKERE, Nduka Ekere, Nduka N. Ekere, Ndy Ekere, Ndy N. Ekere
Observed institutions: University of Wolverhampton, City University of Hong Kong, Kwame Nkrumah University of Science and Technology, University of Manchester, Universities at Medway, Hochschule für Technik und Wirtschaft Dresden – University of Applied Sciences, University of Salford, University of Greenwich, Liverpool John Moores University, Tunku Abdul Rahman University of Management and Technology, Universiti Tunku Abdul Rahman
ORCID: 0000-0002-9955-8244
Observed ORCID: 0000-0002-9955-8244
OpenAlex ID: A5073710450
Investigation of thermal management materials for automotive electronic control units
2010 · Sabuj Mallik, Ndy Ekere, et al. · Applied Thermal Engineering · 234
Computer simulation of random packing of unequal particles
1999 · D. He, N. N. Ekere, et al. · Physical review. E, Statistical physics, plasmas, fluids, and related interdisciplinary topics · 180
A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly
2015 · Musa T. Zarmai, N.N. Ekere, et al. · Applied Energy · 152
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
2011 · K.C. Otiaba, N.N. Ekere, et al. · Microelectronics Reliability · 147
A review of photovoltaic module technologies for increased performance in tropical climate
2016 · Osarumen O. Ogbomo, Emeka H. Amalu, et al. · Renewable and Sustainable Energy Reviews · 133
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A novel health indicator for intelligent prediction of rolling bearing remaining useful life based on unsupervised learning model
2023 · Zifei Xu, Musa Bashir, et al. · Computers & Industrial Engineering · 117
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Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes
2009 · R. Durairaj, S. Ramesh, et al. · Materials & Design (1980-2015) · 101
Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
2018 · Osarumen O. Ogbomo, Emeka H. Amalu, et al. · Solar Energy · 91
Effect of particle size ratio on the conducting percolation threshold of granular conductive–insulating composites
2004 · Da He, N N Ekere · Journal of Physics D Applied Physics · 89
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High temperature reliability of lead-free solder joints in a flip chip assembly
2011 · Emeka H. Amalu, Ndy N. Ekere · Journal of Materials Processing Technology · 73
Multi-scale collision risk estimation for maritime traffic in complex port waters
2023 · Xuri Xin, Kezhong Liu, et al. · Reliability Engineering & System Safety · 71
Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections
2017 · Musa T. Zarmai, N.N. Ekere, et al. · Robotics and Computer-Integrated Manufacturing · 68
Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach
2012 · Kenny C. Otiaba, R.S. Bhatti, et al. · Engineering Failure Analysis · 68
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
2012 · Kenny C. Otiaba, R.S. Bhatti, et al. · Microelectronics Reliability · 66
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
2016 · Emeka H. Amalu, N.N. Ekere · Journal of Manufacturing Systems · 62
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
2008 · R. Durairaj, S. Mallik, et al. · Journal of Materials Processing Technology · 58
Reflow profile study of the Sn‐Ag‐Cu solder
2004 · B. Salam, C. Virseda, et al. · Soldering and Surface Mount Technology · 53
Correlation of solder paste rheology with computational simulations of the stencil printing process
2002 · R. Durairaj, G.J. Jackson, et al. · Soldering and Surface Mount Technology · 51
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
2011 · E.H. Amalu, N.N. Ekere, et al. · Materials & Design (1980-2015) · 47
Crack initiation and growth in PV module interconnection
2020 · Alireza Eslami Majd, Nduka Nnamdi Ekere · Solar Energy · 45
Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly
2015 · M.T. Zarmai, N.N. Ekere, et al. · Microelectronics Reliability · 45
Parameter Interactions in Stencil Printing of Solder Paste
1996 · L. HASLEHURST, N.N. EKERE · Journal of Electronics Manufacturing · 45
Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation
2002 · B. Salam, N.N. Ekere, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 44
Thixotropy flow behaviour of solder and conductive adhesive pastes
2004 · R. Durairaj, N. N. Ekere, et al. · Journal of Materials Science Materials in Electronics · 43
Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage
2017 · Osarumen O. Ogbomo, Emeka H. Amalu, et al. · Procedia Manufacturing · 38
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Works count: 182
Citation count: 3,557
H-index: 32
I10-index: 85
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