Get started
Author

Willem Dirk van Driel

Observed names: Dirk, Willem, Driel Willem van, Driel, W. D, Driel, W. Van, Driel, W.D. van, Driel, WD, Driel, WD Willem van, Driel, van, W.D., Driel, van, WD Willem, Van Driel, Van Driel, Willem, W D Van Driel, W D van Driel, W. D van Driel, W. D. V. Driel, W. D. VAN DRIEL, W. D. Van Driel, W. D. van Driel, W. Van Driel, W. van Driel, W.D van Driel, W.D. Van Driel, W.D. van Driel, W.D. van El, W.D.v Driel, W.D.v. Driel, WD van Driel, Willem D. Van Driel, Willem D. van DRIEL, Willem D. van Driel, Willem D.Van Driel, Willem VD Driel, Willem Van Driel, Willem van DRIEL, Willem van Driel, Williem van Driel, van Driel, W.D., van Driel, W.D. (author), van Driel, WD, van Driel, Willem, van Driel, Willem D., van Willem Driel
Observed institutions: NXP (Netherlands), Intel (United States), Radboud University Nijmegen, Netherlands Organisation for Applied Scientific Research, Lamar University, Chinese Academy of Sciences, Trinity College Dublin, Caraga State University, Radboud University Medical Center, Materials innovation institute, Philips (Netherlands), NXP (Germany), NXP (Belgium), Institute of Semiconductors, Signify (Netherlands), Delft University of Technology
ORCID: 0000-0001-8882-2508
Observed ORCID: 0000-0001-8882-2508
OpenAlex ID: A5073722171
Mechanics of Microelectronics
2006 · Zhang, G. Q, Fan, X. J, et al. · Solid mechanics and its applications · 209
A biomechanical regulatory model for periprosthetic fibrous-tissue differentiation
1997 · R HUISKES, W. D. VAN DRIEL, et al. · Journal of Materials Science Materials in Medicine · 207
PDF
Design Approach to Sealant Selection for the Life of the Well
1999 · Martin Bosma, Kris Ravi, et al. · SPE Annual Technical Conference and Exhibition · 178
Solid State Lighting Reliability
2012 · Driel, WD, Fan, XJ · Springer eBooks · 116
Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning
2008 · Xuejun Fan, G.Q. Zhang, et al. · IEEE Transactions on Components and Packaging Technologies · 111
A Comparison of Finite Element Codes for the Solution of Biphasic Poroelastic Problems
1996 · P J Prendergast, W D van Driel, et al. · Proceedings of the Institution of Mechanical Engineers Part H Journal of Engineering in Medicine · 111
Degradation of optical materials in solid-state lighting systems
2019 · M. Yazdan Mehr, A. Bahrami, et al. · International Materials Reviews · 97
PDF
Time-dependent mechanical behaviour of the periodontal ligament
2000 · W D van Driel, E J van Leeuwen, et al. · Proceedings of the Institution of Mechanical Engineers Part H Journal of Engineering in Medicine · 96
Design Approach to Sealant Selection for the Life of the Well
1999 · Martin Bosma, Kris Ravi, et al. · SPE Annual Technical Conference and Exhibition · 90
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
2012 · M. Yazdan Mehr, W.D. van Driel, et al. · Optical Materials · 84
Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
2020 · Mesfin Seid Ibrahim, Jiajie Fan, et al. · Laser & Photonics Review · 80
PDF
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
2008 · E.H. Wong, C.S. Selvanayagam, et al. · Journal of Electronic Materials · 79
Creep fatigue models of solder joints: A critical review
2016 · E.H. Wong, W.D. van Driel, et al. · Microelectronics Reliability · 72
Advances in the drop-impact reliability of solder joints for mobile applications
2009 · E.H. Wong, S.K.W. Seah, et al. · Microelectronics Reliability · 64
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
2019 · Brahim El Mansouri, Luke M. Middelburg, et al. · Microsystems & Nanoengineering · 63
PDF
Prediction and verification of process induced warpage of electronic packages
2003 · W.D. van Driel, G.Q. Zhang, et al. · Microelectronics Reliability · 57
Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages
2008 · W.D. van Driel, M.A.J. van Gils, et al. · IEEE Transactions on Components and Packaging Technologies · 55
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
2003 · W. D. van Driel, J. H. J. Janssen, et al. · Journal of Electronic Packaging · 52
Facing the challenge of designing for Cu/low-k reliability
2007 · W.D. van Driel · Microelectronics Reliability · 50
Response Surface Modeling for Nonlinear Packaging Stresses
2003 · W. D. van Driel, G. Q. Zhang, et al. · Journal of Electronic Packaging · 50
Numerical modeling of warpage induced in QFN array molding process
2007 · D.G. Yang, K.M.B. Jansen, et al. · Microelectronics Reliability · 48
Color Shift Investigations for LED Secondary Optical Designs: Comparison between BPA-PC and PMMA
2015 · Guangjun Lu, M. Yazdan Mehr, et al. · Optical Materials · 46
Prediction of Delamination Related IC & Packaging Reliability Problems
2005 · W.D. van Driel, M.A.J. van Gils, et al. · Microelectronics Reliability · 45
Why does intermittent hydrostatic pressure enhance the mineralization process in fetal cartilage?
1999 · E Tanck, W.D van Driel, et al. · Journal of Biomechanics · 45
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
2017 · Bo Sun, Xuejun Fan, et al. · Reliability Engineering & System Safety · 44
Works count: 470
Citation count: 5,103
H-index: 35
I10-index: 140
Year
Topic
Type