Get started
Author

Ziyu Liu

Digital Light Processing 3D-Printed Ceramic Metamaterials for Electromagnetic Wave Absorption
2022 · Rui Zhou, Yansong Wang, et al. · Nano-Micro Letters · 189
PDF
Magnetic graphene composite aerogel for highly efficient electromagnetic wave absorption and anti-corrosion
2025 · Yinglai Hou, Ziyu Liu, et al. · Journal of Material Science and Technology · 46
Hyperbranched polyborosilazanes derived SiBCN ceramic for high-temperature wave-transparent performance
2024 · Zhen Yu, Mingwei Ma, et al. · Journal of Material Science and Technology · 38
Nanoparticles‐doped polymer‐derived SiCN ceramic with enhanced mechanical properties and electromagnetic wave absorption
2024 · Runqiu Zhu, Shuo Jin, et al. · Journal of the American Ceramic Society · 28
Phase-Transformation Nanoparticles Synchronously Boosting Mechanical and Electromagnetic Performance of SiBCN Ceramics
2023 · Yan Song, Runqiu Zhu, et al. · ACS Applied Materials & Interfaces · 26
Preparation of microfiltration membrane with good conductivity and its antifouling performance
2024 · Yanqing Liu, Jiazhu Li, et al. · Materials Today Communications · 4
Tailoring starting powder composition with Si and Si3N4 for oxygen removal and microstructure optimization in high-thermal-conductivity Si3N4 ceramics
2026 · Hehan Xie, Peng Liu, et al. · Ceramics International · 3
Reshaping Sacred Spaces into Everyday Living: A Morphological and Graph-Based Analysis of Urban Ancestral Temples in Chinese Historic Districts
2025 · Ziyu Liu, Yipin Xu, et al. · Buildings · 3
Fast low-temperature–pressure Cu-Sn mechanical interlock bonding (MIB) applied for 3D integration
2023 · Hao Wang, Ziyu Liu, et al. · Materials Letters · 3
Preparation and anti-fouling behavior of conductive and hydrophilic polypyrrole modified PVDF composite membrane
2024 · Ziyu Liu, Yanqing Liu, et al. · Journal of Polymer Engineering · 2
Thermal Finite Element Simulation of Ultrafine Pitch Chip-to-Wafer Hybrid Bonding
2023 · Weimin Liu, Ziyu Liu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Novel Triple-Gate Nanosheet RFET With Embedded SiGe Surrounding Channel for Enhanced On-State Current
2026 · Xinyu Zou, Yuhao Zhou, et al. · IEEE Transactions on Electron Devices · 1
Seismic Spectrum Analysis for Tower Crane
2009 · Ziyu Liu · Journal of Xianyang Normal University · 1
CMP-Free Organic Hybrid Bonding Based on Mechanical Interlock Structure via Surface Treatments for 3-D Integration
2026 · Jinzhu Li, Qicun Lou, et al. · IEEE Electron Device Letters
Nonvolatile OR Logic Gates Enabled by Single Quad-RRAM Device
2026 · Wenjin Yang, Yang Shen, et al. · IEEE Transactions on Electron Devices
Particle Removal by Surface Protection and Adhesion in the Wafer Dicing Applied to Chip-to-Wafer Hybrid Bonding
2026 · Hao Wang, Haoyue Song, et al. · IEEE Transactions on Semiconductor Manufacturing
qPRO-AQFP: Post-Routing Optimization of AQFP Circuits with Delay Line Clocking
2026 · Aviles, Robert S., Liu, Ziyu, et al. · arXiv (Cornell University)
PDF
Novel Reconfigurable Feedback Field-Effect Transistor With Single Gate for Unified RAM (URAM) and In-Memory-Computing Applications
2026 · Yuhao Zhou, Yang Shen, et al. · IEEE Transactions on Electron Devices
Novel FOM-enhanced sided-shield gate trench MOSFET with super-junction structure
2026 · Hincheung Yu, Yabin Sun, et al. · Semiconductor Science and Technology
Assessment of Capacitorless DRAM Based on Stacked Nanosheet Feedback Field-Effect Transistors With Tree-Type Channel
2026 · Yuhao Zhou, Xinyu Zou, et al. · IEEE Transactions on Electron Devices
Data-driven departure time and traffic assignment model for intercity multimodal transport system
2026 · Di Huang, Ziyu Liu, et al. · Computers & Industrial Engineering
A Physics-Constrained Neural Network Method for Compact Modeling of Semiconductor Devices
2026 · Fu Gong, Xinyu Zou, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
A Novel Pretreatment Approach to High-quality SiO 2 Surface Applied for C2W Cu/SiO 2 Hybrid Bonding
2025 · Han Jiang, Xianlong Wang, et al. · IEEE International Conference on ASIC (ASICON)
Multi-Chip 3D Integration Using Mechanical Interlock Bonding (MIB) Technology and Optimized TSV
2024 · Hao Wang, Ziyu Liu, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Application and Optimization of Laser-Assisted Bonding (LAB) in Multi-Chip Integration
2024 · Chengyong Zhang, Ziyu Liu, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Works count: 27
Citation count: 350
H-index: 5
I10-index: 5
Year
Topic
Type