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Philippe Soussan

Observed names: P Soussan, P. Soussan, SOUSSAN, PHILIPPE
Institution: IMEC
ORCID: 0000-0002-1347-6978
Observed ORCID: 0000-0002-1347-6978
OpenAlex ID: A5083011814
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance
2010 · A. Mercha, G. Van der Plas, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 122
A compact, high-speed, and low-cost hyperspectral imager
2012 · Nicolaas Tack, Andy Lambrechts, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 118
Cu/Sn microbumps interconnect for 3D TSV chip stacking
2010 · Rahul Agarwal, Wenqi Zhang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 100
Through-silicon via and die stacking technologies for microsystems-integration
2008 · Eric Beyne, Piet De Moor, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 88
A CMOS-compatible, integrated approach to hyper- and multispectral imaging
2014 · Andy Lambrechts, Pilar Gonzalez, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 78
High-pulse-energy III-V-on-silicon-nitride mode-locked laser
2021 · Artur Hermans, Kasper Van Gasse, et al. · APL Photonics · 60
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Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging
2009 · Deniz S. Tezcan, Fabrice Duval, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 50
3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias
2011 · Yann Civale, Deniz Sabuncuoglu Tezcan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 49
Grating devices on a silicon nitride technology platform for visible light applications
2019 · Jeong Hwan Song, Tangla D. Kongnyuy, et al. · OSA Continuum · 43
Effect of substrate charging on the reliability of capacitive RF MEMS switches
2008 · P. Czarnecki, X. Rottenberg, et al. · Sensors and Actuators A Physical · 40
Electrically yielding Collective Hybrid Bonding for 3D stacking of ICs
2009 · Anne Jourdain, Philippe Soussan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Polymer Filling of Silicon Trenches for 3-D Through Silicon vias Applications
2011 · Fabrice F. C. Duval, Chukwudi Okoro, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 33
Optical phased array with on-chip phase calibration
2022 · Mathias Prost, Jon Øyvind Kjellman, et al. · Optics Letters · 30
High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA
2006 · Xiao Sun, Olivier Dupuis, et al. · IEEE Transactions on Advanced Packaging · 30
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping
2009 · Y. Civale, D. Sabuncuoglu Tezcan, et al. · IEEE International Conference on 3D System Integration (3DIC) · 27
New insights into charging in capacitive RF MEMS switches
2008 · P. Czarnecki, X. Rottenberg, et al. · IEEE International Reliability Physics Symposium proceedings · 27
Influence of the substrate on the lifetime of capacitive RF MEMS switches
2008 · P. Czarnecki, X. Rottenberg, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 26
24 GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors
2005 · O. Dupuis, Xiao Sun, et al. · European Solid-State Circuits Conference (ESSCIRC) · 24
High density 20μm pitch CuSn microbump process for high-end 3D applications
2011 · J. De Vos, A. Jourdain, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
Heterogeneous tunable III-V-on-silicon-nitride mode-locked laser emitting wide optical spectra
2024 · Maximilien Billet, Stijn Cuyvers, et al. · Photonics Research · 22
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Densely Integrated Phase Interrogators for Low-Complexity On-Chip Calibration of Optical Phased Arrays
2022 · Jon Oyvind Kjellman, Mathias Prost, et al. · Journal of Lightwave Technology · 22
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding
2010 · Cedric Huyghebaert, Jan Van Olmen, et al. · IEEE International Interconnect Technology Conference (IITC) · 22
A low-cost 90nm RF-CMOS platform for record RF circuit performance
2005 · W. Jeamsaksiri, D. Linten, et al. · Symposium on VLSI Technology · 22
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
2011 · W. Zhang, B. Dimcic P. Limaye, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
2010 · W. Zhang, P. Limaye, et al. · Electronic System-Integration Technology Conference (ESTC) · 20
Works count: 130
Citation count: 1,653
H-index: 22
I10-index: 47
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