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Kari Schjølberg‐Henriksen

Observed names: K Schj lberg-Henriksen, K Schjølberg-Henriksen, K. Schjlberg-Henriksen, K. Schjolberg-Henriksen, K. Schjølberg-Henriksen, Kari Schjolberg-Henriksen, Kari Schjo̸lberg-Henriksen, Kari SchjøLberg-Henriksen, Kari Schjølberg-Henriksen, Schjølberg-Henriksen, Kari
OpenAlex ID: A5087435159
Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold
2004 · M M V Taklo, P Storås, et al. · Journal of Micromechanics and Microengineering · 106
AlAl thermocompression bonding for wafer-level MEMS sealing
2014 · N. Malik, K. Schjølberg-Henriksen, et al. · Sensors and Actuators A Physical · 61
Capacitive differential pressure sensor for harsh environments
2000 · S.T Moe, K Schjølberg-Henriksen, et al. · Sensors and Actuators A Physical · 57
Wafer-level Au–Au bonding in the 350–450 °C temperature range
2014 · Hannah R Tofteberg, Kari Schjølberg-Henriksen, et al. · Journal of Micromechanics and Microengineering · 35
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Anodic bonding of glass to aluminium
2005 · K. Schjølberg-Henriksen, E. Poppe, et al. · Microsystem Technologies · 30
Impact of SiO 2 on Al–Al thermocompression wafer bonding
2015 · Nishant Malik, Kari Schjølberg-Henriksen, et al. · Journal of Micromechanics and Microengineering · 26
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Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing
2008 · Kari Schjolberg-Henriksen, Olaf Schulz, et al. · IEEE Sensors Journal · 25
Sodium contamination of SiO2caused by anodic bonding
2003 · K Schj lberg-Henriksen, G U Jensen, et al. · Journal of Micromechanics and Microengineering · 20
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
2014 · S. Brand, S. Tismer, et al. · Microsystem Technologies · 19
Anodic bonding for monolithically integrated MEMS
2004 · K. Schjølberg-Henriksen, G.U. Jensen, et al. · Sensors and Actuators A Physical · 19
High-resolution pressure sensor for photo acoustic gas detection
2006 · K. Schjølberg-Henriksen, D.T. Wang, et al. · Sensors and Actuators A Physical · 18
Low-Temperature Aluminum-Aluminum Wafer Bonding
2016 · Bernhard Rebhan, Andreas Hinterreiter, et al. · ECS Transactions · 17
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Low-temperature plasma activated bonding for a variable optical attenuator
2007 · Kari Schjølberg-Henriksen, Sigurd Moe, et al. · Sensors and Actuators A Physical · 17
Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias
2012 · J Due-Hansen, K Midtbø, et al. · Journal of Micromechanics and Microengineering · 16
Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding
2017 · Mark S. Goorsky, Kari Schjølberg-Henriksen, et al. · Japanese Journal of Applied Physics · 12
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Oxide charges induced by plasma activation for wafer bonding
2002 · K. Schjølberg-Henriksen, M.M. Visser Taklo, et al. · Sensors and Actuators A Physical · 10
Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
2015 · N. Malik, H. R. Tofteberg, et al. · ECS Journal of Solid State Science and Technology · 7
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Technologies enabling 3D stacking of MEMS
2010 · Maaike M. Visser Taklo, Michal M. Mielnik, et al. · BIBSYS Brage (BIBSYS (Norway)) · 7
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Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)
2009 · Kari Schjølberg-Henriksen, Maaike Margrete Visser Taklo, et al. · Springer eBooks · 7
Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
2014 · Nisant Malik, Hannah Tofteberg, et al. · ECS Transactions · 5
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Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
2014 · Nisant Malik, Erik Poppe, et al. · ECS Transactions · 5
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Al-Al thermocompression bonding for wafer-level MEMS packaging
2013 · N. Malik, K. Schjolberg-Henriksen, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 5
Electrical Effects of Anodic Bonding on Silicon Dioxide Situated in Pyrex Cavities
2002 · K. Schjølberg-Henriksen, A. B. Hanneborg, et al. · Journal of The Electrochemical Society · 5
Texture of Al films for wafer-level thermocompression bonding
2017 · Nishant Malik, Vishnukanthan Venkatachalapathy, et al. · Superlattices and Microstructures · 4
Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity
2015 · N. Malik, E. Poppe, et al. · ECS Journal of Solid State Science and Technology · 4
Works count: 64
Citation count: 608
H-index: 14
I10-index: 16
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