Author

Samuel Hartmann

Observed name: S. Hartmann

Observed institution: ABB (Switzerland)

OpenAlex ID: A5087435543

Analysis of insulation failure modes in high power IGBT modules

2005 · J.-H. Fabian, S. Hartmann, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 100

Next Generation IGBT and Package Technologies for High Voltage Applications

2017 · Arnost Kopta, Munaf Rahimo, et al. · IEEE Transactions on Electron Devices · 46

Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

2008 · L. Feller, S. Hartmann, et al. · Microelectronics Reliability · 44

Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts

2014 · Emre Özkol, Samuel Hartmann, et al. · Microelectronics Reliability · 33

A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies

2016 · Slavo Kicin, Felix Traub, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 30

LinPak, a new low inductive phase-leg IGBT module with easy paralleling for high power density converter designs

2015 · Raffael Schnell, Samuel Hartmann, et al. · PCIM Europe: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe) · 28

Enhanced power cycling performance of IGBT modules with a reinforced emitter contact

2015 · Emre Özkol, Franziska Brem, et al. · Microelectronics Reliability · 26

Observation of chip solder degradation by electrical measurements during power cycling

2010 · Samuel Hartmann, M.J. Bayer, et al. · International Conference on Integrated Power Electronics Systems (CIPS) · 20

Reliability of Lead-free Large Area Solder Joints in IGBT Modules with Respect to Passive and Active Thermal Cycling

2016 · Horst Beyer, V. Sivasubramaniam, et al. · 14

Numerical Simulations for Electromagnetic Power Module Design

2006 · D. Cottet, S. Hartmann, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 11

packagingan IGBT module packaging for high-quality and reliable operation

2008 · Daniel Schneider, Lydia Feller, et al. · 9

Packaging Technology Platform for Next Generation High Power IGBT Modules

2014 · Samuel Hartmann, V. Sivasubramaniam, et al. · PCIM Europe: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe) · 8

Evaluation of insulation material in advanced high power IGBT modules with extended operation temperature

2010 · Lydia Feller, Samuel Hartmann, et al. · International Conference on Integrated Power Electronics Systems (CIPS) · 8

1.7 kV High-Current SiC Power Module Based on Multi-Level Substrate Concept and Exploiting MOSFET Body Diode during Operation

2017 · Slavo Kicin, Stanislav Skibin, et al. · 7

Fast and reliable switching of parallel SiC MOSFET chips in a Halfbridge module

2020 · A. Mesemanolis, Milad Maleki, et al. · PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management · 4

Interpretation of Power Cycling Data derived from transient Cooling Curves

2018 · M.J. Bayer, Samuel Hartmann, et al. · 3

The Next Generation High Voltage Package and IGBT/Diode Technologies

2016 · Raffael Schnell, Sven Matthias, et al. · 2

Silicon based devices for demanding high power applications

2018 · A. Kopta, J. Vobecky, et al. · International Power Electronics Conference (IPEC) · 1

Advanced IGBT and Packaging Technologies for Next Generation High Power Applications

2017 · Evgeny Tsyplakov, Franc Dugal, et al. · 1

Empaquetamientos que mejoran las prestaciones: diseño de un paquete de módulos IGBT que proporciona un funcionamiento fiable y de gran calidad

2008 · Daniel Schneider, Lydia Feller, et al. · Hispana

Works count: 21

Citation count: 395

H-index: 10

I10-index: 10