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Joshua Holverscheid
OpenAlex ID:
A5090057783
Reliability of lead-free solders for die attach in automotive power modules
2022
·
Bettina Ottinger
, Joshua Holverscheid
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modules
2023
·
Bettina Ottinger
, Joshua Holverscheid
, et al.
·
IMAPSource Proceedings
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Citation count:
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