Author

Jim VanGilder

Observed names: J.W. VanGilder, Jim Vangilder, Jim W. VanGilder, VanGilder, Jim
OpenAlex ID: A5109512902
2020 · Xu Han, Wei Tian, et al. · Energy and Buildings · 61
2007 · Madhusudan Iyengar, Roger R. Schmidt, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 57
2019 · Yangyang Fu, Wangda Zuo, et al. · Energy and Buildings · 54
2009 · S.K. Shrivastava, M. Iyengar, et al. · IEEE Transactions on Components and Packaging Technologies · 33
2019 · Wei Tian, Jim VanGilder, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 18
2007 · S.K. Shrivastava, J.W. VanGilder, et al. · IEEE Transactions on Components and Packaging Technologies · 14
2020 · Beichao Hu, Cheng-Xian Lin, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 6
2021 · Beichao Hu, Cheng-Xian Lin, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
2022 · Jim VanGilder, Wei Tian, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Works count: 10
Citation count: 246
H-index: 6
I10-index: 6
Year
Topic
Type