Author

Tenghsien Lai

Observed names: Lai, Tenghsien, T. Lai, T.S. Lai, Teng-Hsien Lai
OpenAlex ID: A5110032314
2013 · Kuan-Chieh Huang, Teng-Hsien Lai, et al. · Applied Optics · 28
2008 · Tenghsien Lai, Changhan Huang, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 20
2011 · Shih-Wei Yang, Chern-Sheng Lin, et al. · Optics Communications · 9
2014 · Kuan-Chieh Huang, Wen-Jie Lu, et al. · Materials Letters · 7
2011 · Chunming Chang, Chenghan Huang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
2006 · C. Tsou, C. Hsu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 6
2013 · Chingfu Tsou, Chunming Chang, et al. · Microsystem Technologies · 4
2012 · T. Lai, C. Tsou · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 4
2010 · Chingfu Tsou, Chunming Chang, et al. · Journal of the Society for Information Display · 3
2005 · Chingfu Tsou, Yeong‐Shyang Huang, et al. · TechConnect Briefs · 3
2011 · Tenghsien Lai, Chingfu Tsou · International Conference on Solid-State Sensors, Actuators and Microsystems · 1
2006 · Chingfu Tsou, Shuen-Lung Huang, et al. · Journal of Physics Conference Series · 1
2013 · Chenghan Huang, Tenghsien Lai, et al. · Journal of Neuroscience and Neuroengineering
2009 · Chao‐Ching Chang, Chi‐Hsiang Huang, et al. · TechConnect Briefs
2008 · H., Huang C. H. Huang C., Tsou, Chingfu, et al. · arXiv (Cornell University)
2005 · Shih-Hsiung Huang, Tenghsien Lai, et al. · TechConnect Briefs
Works count: 17
Citation count: 93
H-index: 6
I10-index: 2
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